Cedrat Technologies, innovation in mechatronicsCedrat Technologies, innovation in mechatronics

Cedrat Technologies, innovation in mechatronics

Herstellung

From prototypes to recurrent batches delivery of mechatronic products, CEDRAT TECHNOLOGIES (CTEC) relies in 2021 on a +20 operators, technicians & engineers work force able to manage both electronic and electromechanical products. This fast-growing team works in collaboration with the Engineering teams from the early design phase to ensure the level of performances, design-to-cost and quality required by our customers all along the Manufacturing Assembly Integration and Testing (MAIT) process of the product. This team manages the manufacturing supply chain and benefits from more than 1,000 sqm (1 000 m²) of production facilities.

Due to the large spectrum of market applications like shown in Scientific, Machining, Medical, Defense and Space, the production team have the capability and flexibility to address different level of quality standards, environmental conditions (up to ISO8 & ISO5 clean room) and production rate (from protoyping to a production rate of few thousands per unit by year).

The Assembly process covers the integration of mechanical parts, PCB (printed circuit boards), piezoelectric ceramics, coil winding, strain gages, sensors, electronic component wiring and mirrors to name but a few. In particular CTEC has developed a technological know-how as regards assembly procedures (pre-stressing, gluing), tribology (behavior of friction drive materials), mounting, cable securing, cleaning, and adjustment of active material applications and electric devices, in combination with drive & control electronics tuning and complex performance testing.

To perform those Assembly, Integration and testing activities, CTEC makes use of its facilities equipped with high end tools and instrumentations:

  • Dimensional metrology: 3D mechanical metrology DERBY, 2D optical metrology DERBY
  • Inspection facilities: CCD camera, microscope, binocular, stereoscopic magnifier,
  • Integration and tests facilities cleanliness: ISO5 & ISO8 100 sqm (100 m²) clean room,
  • Mounting facilities: pneumatic and hydraulic presses for gluing and mechanical pre-stress,
  • Electronic assembly facilities: welding / un-welding SMD equipment’s , binocular microscopes,
  • Vibration tests bench: LDS Electrodynamic Shaker, Vibration pot, loudspeaker,
  • Loading mechanical bench: inertial benches, hysteresis breaks …
  • Loading fluid bench: pneumatic and hydraulic benches,
  • TV chambers allowing tests in temperature of -150°C to +150°C and/or in partial or ultra-high vacuum environment
  • Climatic chamber controlled in humidity (rH from 20% to 100%)
  • Multi channels acquisition boards and LABVIEW / PYTHON processing software, associated data logger cards, scanners for multiple acquisitions,
  • Power supplies, power amplifiers, signal generators, inductors,
  • Gauss-meters, Flux-meter and compensation coils for non-magnetic testing,
  • Signal analyser HP35670A, Impedance-meter Keysight E4990 (with automatic identification of equivalent circuits), and power (Watt-meters) analysis benches,
  • MCC FOGALE capacitive sensors, LVDT SENSOREX inductive sensors, optical encoders, thermal probes,
  • POLYTEC Laser interferometers & vibrometers for nanometric stroke measurement from 0 Hz to 2 MHz,
  • ATTOCUBE FPS3010 3 Channels Fibre Interferometric Sensor Laser offering picometer measurement capability,  
  • TRIOPTIC Tri-Angle Autocollimators giving an absolute Precision < 0,75 arcsec & repeatability of 0.1arcsec,
  • ZYGO Interferometers,
  • Optical table with pneumatic vibration isolation system, translation and rotation stages.